Capabilities and uses - Curing UV ink - Curing the adhesive without shadows - UV curing for 3D printing - Curing of PCBs - Cure OCA adhesive - Solidify UV varnish - Curing epoxy resin adhesive - Curing of UV adhesive Key benefits - Supports multiple curing tasks in electronics and display manufacturing - Enables reliable, uniform cure across inks, adhesives, OCA, UV varnish, and epoxy resins - Shadow-free adhesive curing improves process margins on dense assemblies - Consolidates curing steps for streamlined production and finishing Compatibility and performance highlights - Functions with common UV based materials including UV inks, UV adhesives, OCA films, UV varnishes, and epoxy resin adhesives - Suitable for curing PCBs and 3D printed parts requiring UV exposure - Maintains material integrity while delivering consistent cure results 2-3 practical use scenarios - Electronics PCB assembly: cure PCB substrates, UV adhesives, and related bonding agents to ensure strong joins and reliable performance - Display and touch module production: cure OCA adhesive and UV varnish to secure displays and achieve durable surface finishes - UV based coating and printing workflows: cure UV inks and UV adhesives in 3D printed parts or surface coatings for fast, shadow-free processing