Style: WSON8-8X6 Compact 8-lead WSON surface-mount package engineered for space-saving PCB designs and reliable automated assembly. Key benefits Space efficiency: Small 8 × 6 footprint reduces board area compared with larger packages, enabling higher component density. Low profile and reliable mounting: WSON form factor provides a low-height solution that is compatible with standard surface-mount assembly and reflow soldering processes. Industry compatibility: Matches industry-standard WSON-8 layouts for easy substitution and PCB footprint reuse. Assembly-friendly: Designed for pick-and-place automation and consistent solder joint formation on standard manufacturing lines. Robust for compact electronics: Suited to applications where minimizing size and maintaining manufacturability are priorities. Important attributes Package style: WSON8-8X6 (8 leads, WSON form factor). Size: 8 × 6 footprint for compact board layouts. Function: Surface-mount packaging for 8-pin integrated circuits (suitable for common IC types that use WSON-8 packages). Compatibility: Intended for PCBs designed to accept a WSON-8 (8×6) package; compatible with standard SMT assembly and reflow profiles. Performance considerations: Supports typical SMD manufacturing flows and is appropriate for high-density, low-profile designs. Use scenarios Portable electronics: Ideal when replacing through-hole or larger packages to shrink overall device size in handheld products. Power and control modules: Use on compact power regulation or control boards where an 8-pin IC in a low-profile package is required. High-density PCBs: Apply in multi-layer boards and modules where board real estate is constrained and consistent automated assembly is needed. What to check before purchase Verify the PCB footprint matches WSON8-8X6 dimensions used in your design. Confirm the target IC’s recommended land pattern and thermal/pad requirements are compatible with the WSON8-8X6 package. Confirm assembly process (reflow profile and solder paste) aligns with your manufacturing capabilities. Specifications summary Style/model: WSON8-8X6 Leads: 8 Footprint: 8 × 6 (WSON-8) This WSON8-8X6 package provides a compact, assembly-friendly option for designs requiring an 8-pin surface-mount IC with a small board footprint and standard SMT manufacturability.